Week - 1 |
Introduction to nanomaterials and nanotechnology |
Week - 2 |
Materials used in MEMS processes (e.g., wafers, resists) and selection parameters |
Week - 3 |
Clean room principles, thin film deposition techniques |
Week - 4 |
Thin film deposition, epitaxial growth, and oxidation processes |
Week - 5 |
Pattern formation in micro/nanoscale via lithography |
Week - 6 |
Doping |
Week - 7 |
Wet etching |
Week - 8 |
Dry etching |
Week - 9 |
Wafer dicing, bonding techniques and sensitivities |
Week - 10 |
Wafer dicing, bonding techniques and sensitivities |
Week - 11 |
Characterization techniques: imaging, surface evaluation and related parameters |
Week - 12 |
Characterization techniques: determination of atomic and crystallographic structure |
Week - 13 |
Key factors in determining suitable MEMS fabrication and characterization techniques |
Week - 14 |
MEMS based device examples, working principles, application areas |